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3D Chip Packaging Unit in Odisha
April 22 , 2026
15 hrs 0 min
34
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- Odisha will host the ground-breaking of India’s first Advanced 3D semiconductor chip packaging unit.
- The unit will be set up in Bhubaneswar using glass substrate-based advanced packaging technology.
- It will introduce 3D heterogeneous integration (advanced chip stacking technology) in India.
- Odisha becomes the first state in India to have both semiconductor fabrication and advanced packaging units.
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